Passive Components
RF Components
Actuator
 
 

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RF Components --- Power Amplifier (PA)
 
Description：
Using flip chip bonding method to integrate MEMS
inductor and CMOS PA.
 
Benefits：
•High Q factor
•Low power consumption
•Linearilize
 
Application：
•Wireless front-end modules ( filters, VCOs, LNAs)
•Wireless modular ( Bluetooth, WLNA)