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Cross Section：
Top View：
Top View：
3D View ：
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| Passive Components --- Integrated Passive Chip |
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| Description： |
| This chip can reduce the IC area substantially. It can be reached with "above IC" process or flip-chip method on more complex boards. |
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| Benefits： |
| •High performance |
| •High integration capabilities |
| •Excellent tolerances and reproducibility |
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| Applications： |
| •Wireless front-end modules (filters, VCOs, LNAs)
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| •Wireless modular (Bluetooth, WLNA)
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