Company Profile
Management
Film Deposition
Photolithography
Dry Etching
Wet Etching
Microelectroplating
Bulk Micromaching
Packaging
Metrology Tools
Analytical Tools
Reliability Tools
委測服務
Passive Components
RF Components
Actuator
Bulk Micromaching
"Above IC" Inductor
Integrated Passive Chip
Power Amplifier (PA)
Voltage Controlled Oscillator (VCO)
Low Pass Filters
MEMS RF Switch
Comb Driver
Film Deposition
Photolithography
Dry Etching
Wet Etching
Microelectroplating
Packaging
Metrology Tools
Analytical Tools
Reliability Tools
委測服務
Microelectroplating
•Deposition material: Cu, Ni, SnPb
•Wafer size: 4", 6”
